Samsung is gearing up to launch three new foldable devices in early July: the Galaxy Z Fold7, Z Flip7, and Z Flip7 FE. Recent reports indicate that mass production is underway, and the company is now preparing to ship demo units to stores. Notably, the rumored tri-fold model is still absent from the lineup. According to a shipping manifest, the Galaxy Z Flip7 FE is expected to weigh 187g, identical to last year’s Z Flip6. The FE model is likely to retain a similar design to its predecessor, featuring a 3.4″ cover display, while the Z Flip7 is expected to boast an edge-to-edge cover display.



Both upcoming foldables are expected to feature Exynos chipsets – the Exynos 2500 in the premium flip model and the Exynos 2400 in the FE version. However, the Z Flip7 will switch to the Snapdragon 8 Elite in North America and China. Meanwhile, the Galaxy Z Fold7 is rumored to be slim and powered by the Snapdragon 8 Elite globally. The Z Flip7 FE might also use a Snapdragon chip, with previous leaks suggesting the Snapdragon 8 Gen 3. As the new Galaxy foldables hit the market, we can anticipate more information surfacing through leaks.
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